Recently, the U.S. patent application "Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof" — a global counterpart patent application filed and owned by Ningbo Sunny Opotech Co., Ltd., with the theme "Camera Module, Its Molded Circuit Board Assembly, Molded Photosensitive Assembly and Manufacturing Method" — has been granted. Previously, 11 patents in this same family have been granted in the United States, 2 patents in South Korea, 1 patent in China, and 1 patent in Japan; currently, the European patent application is in progress.

Beijing Tangsong Yongxin Intellectual Property Agency Co., Ltd. was entrusted by Ningbo Sunny Opotech Co., Ltd. to provide full-cycle consulting services for this U.S. counterpart patent application, including selecting foreign firms, preparing documents, and responding to office actions.